Technology Description: As part of the Tacky Dot® donation, the University is offering for commercialization the improved method and apparatus for precise placement of an array of single particles on a surface (see Patents 6,143,374 and 6,406,541).
State of Development: The method is widely applicable and is available for many fields of use.
Related Materials: See also the News Release of the Department of Science and Engineering for information on the donation. Use of the trademark can also be made available.
Keywords: Solder bumping, particle mounting, microscopy, semiconductor fabrication, flat panel displays, photocatalytic materials, environmental cleanup
Case Number : SD2002-090, SD2002-823, SD2002-824
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